CO2 laser marking tshuab yog ib lub tshuab uas siv lub laser beam mus tas li kos ntau qhov chaw ntawm cov khoom sib txawv. Cov txiaj ntsig ntawm kev kos yog txhawm rau nthuav tawm cov khoom sib sib zog nqus los ntawm evaporation ntawm cov khoom nto, yog li carving cov qauv zoo, cov cim lag luam, hnub tim, lub logo, lossis cov ntawv nyeem. Tam sim no, CO2 laser npav tshuab yog tsuas yog siv nyob rau hauv cov xwm txheej uas yuav tsum tau ntau precision thiab precision. Siv rau hauv kev lag luam xws li zaub mov, tshuaj, cawv, khoom siv hluav taws xob, kev sib xyaw ua ke (ICs), cov khoom siv hluav taws xob, kev sib txuas lus ntawm tes, cov ntaub ntawv hauv tsev, PVC kav, thiab lwm yam., qhov zoo ntawm CO2 laser marking machines thiab inkjet printers yog qhov tsis muaj. consumables thiab permanence.
Laser npav yog siv lub laser beam mus tas li cim qhov chaw ntawm ntau yam khoom. Cov txiaj ntsig ntawm kev kos yog kom nthuav tawm cov khoom sib sib zog nqus los ntawm kev ua kom cov khoom ntog, lossis "kos" cov kab ntawm cov khoom nto los ntawm cov tshuaj thiab lub cev hloov pauv los ntawm lub teeb lub zog, lossis hlawv tawm qee yam khoom los ntawm lub teeb lub zog los tso saib cov qauv uas xav tau. thiab ntawv.
Muaj ob txoj hauv kev lees paub:
Thermal processing yog laser beam nrog lub zog ceev (uas yog lub zog muaj zog txaus) uas yog irradiated rau saum npoo ntawm cov khoom ua tiav. Cov khoom nto absorbs laser zog thiab tsim ib tug thermal excitation txheej txheem nyob rau hauv lub irradiation cheeb tsam, ua rau qhov kub ntawm cov khoom nto (los yog txheej) nce, uas ua rau phenomena xws li deformation, melting, ablation, thiab evaporation.
Kev ua haujlwm txias muaj xws li photons nrog lub zog siab load (ultraviolet), uas tuaj yeem rhuav tshem cov tshuaj lom neeg hauv cov ntaub ntawv (tshwj xeeb tshaj yog cov khoom siv organic) lossis cov xov xwm nyob ib puag ncig, ua rau cov txheej txheem tsis thermal puas rau cov khoom. Hom kev ua haujlwm txias no muaj qhov tseem ceeb tshwj xeeb hauv kev ua laser npav vim tias nws tsis yog thermal ablation, tab sis yog qhov txias txias uas tsis ua rau "thermal puas" cov kev mob tshwm sim thiab rhuav tshem cov tshuaj lom neeg. Yog li ntawd, nws tsis tsim cua sov los yog thermal deformation ntawm lub puab txheej thiab cov cheeb tsam nyob ze ntawm cov txheej txheem nto. Piv txwv li, hauv kev lag luam hluav taws xob, excimer lasers yog siv los tso cov tshuaj nyias nyias ntawm cov ntaub ntawv substrate thiab tsim cov grooves nqaim ntawm semiconductor substrates.